1. Has the Association determined that ESD is a problem when pulling a label from backing material or when applying labels to PC boards, integrated circuits, or related hardware? If so, where do the problems arise and what resulting failures have been documented? Larry, Bellows Falls, VT


  1. There are many variables related to labels such as size of the labels, the types of materials in the adhesive or label, the sensitivity of the components, relative humidity, etc. Worse case scenarios can theoretically cause device failure. In practice, we are unaware of any documented cases. Precautions may include ionization, dissipative labels, and/or small labels.

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